RightCool Tech provides Direct-to-Chip (D2C) micro-channel cold plates and smart CDU controllers designed to handle 1000W+ TDP per socket.
Minimizing thermal resistance while maximizing fluid dynamic efficiency across high-density server nodes.
Optimized fluid loop dynamic head loss, drastically reducing CDU electrical overhead.
Enabling hyperscale and edge data centers to meet ultra-low PUE energy requirements.
Precision CNC micro-fin geometry customized for next-gen GPU, TPU, and CPU accelerators.
Integrated pressure regulation, dual-redundant fluid sensors, and zero-leak quick disconnect couplings.
Standardized parameters for 1U/2U/4U server blade integration.
| Cooling Method | Direct-to-Chip (D2C) Liquid Cooling |
| Cold Plate Material | C1100 Oxygen-Free High-Conductivity Copper |
| Micro-Channel Fin Density | 0.12 mm Fin Thickness / 0.15 mm Gap |
| Coolant Fluid Compatibility | PG25 / PG30 Water Mixture & Dielectric Fluids |
| Operating Flow Rate | 1.5 – 3.2 L/min Per Socket |
| Controller Interface | CAN-Bus / RS-485 / Modbus RTU / PWM |